Showing 57–65 of 65 results
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R 150Intel Pentium G2030 2 Cores & 2 Threads 3.0 GHz Clock Speed 3MB Cache Memory Intel Pentium G (Processor Family) Processor socket: LGA 1155 (Socket H2) Memory channels: Dual-channel Maximum RAM supported: 32 GB DDR3 On-board graphics : Intel® HD Graphics Graphics base frequency: 650 MHz Graphics dynamic frequency (max): 1050 MHz. Enhanced Intel Speed Step Technology Thermal Monitoring Technologies
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Pentium Dual-Core
Model number Â
G2030
Frequency Â
3 GHz / 3000 MHz
Bus speed
5 GT/s Direct Media Interface
Clock multiplier
30
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 / H2 / LGA1155
Size
Architecture / Microarchitecture
Instruction set
x86
Microarchitecture
Ivy Bridge
Processor codename
Ivy Bridge
Core stepping
P0
Manufacturing process
0.022 micron
Data width
1.48″ x 1.48″ / 3.75cm x 3.75cm
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated
Level 1 cache size  ?Â
2 x 32 KB instruction caches
Level 2 cache size  ?Â
2 x 256 KB
Level 3 cache size
3 MB
Physical memory
32 GB
Multiprocessing
Integrated Graphics Processing Unit
GPU Type
HD (Ivy Bridge)
Microarchitecture
Gen 7
Base frequency (MHz)
650
Maximum frequency (MHz)
1050
Display controller
3 displays
Uniprocessor
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R 250Brand Intel CPU Manufacturer Intel CPU Model Pentium CPU Speed 3.2 GHz CPU Socket LGA 1150 Platform Windows Secondary Cache 3 MB Wattage 53 watts Cache Size 3 Number of Processors 2
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R 150
Brand:Intel Series:Pentium Model Number:G645 Watts:65 W Socket:LGA1155 Processor Speed:2.90 GHz Processor Cores:2 Onboard GPU:2nd Gen. Intel HD Graphics Memory Channels:2 Processor:Intel Pentium G645 (2.90 GHz) 2C CPU Brand:Intel Architecture:Sandy Bridge Processor Family:Legacy Intel® Pentium® Processor Launch Date:Q3’12 Bus Speed:5 GT/s Number of Threads:2 CPU Cache:3 MB Intel® Smart Cache Compatible RAM:DDR3 1066 FSB:1066MHz
R 250Original price was: R250. R 120Current price is: R120. Intel Pentium G2020 Dual-core (2 Core) 2.90 Ghz Processor – Socket H2 Lga-1155 retail Pack – 512 Kb – 3 Mb Cache – 5 Gt/s Dmi – Yes – 22 Nm – Intel Hd Graphics Graphics – 55 W
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R 740
Brand
Intel
Series
9th Gen Coffee Lake
Model
BX80684i39100 (i3 9100)
Total Cores
4
Total Threads
4
Max Turbo Frequency
3.60 GHz
Performance-core Base Frequency
4.20 GHz
Cache
6 MB Intel® Smart Cache
Total L2 Cache
256K (per core)
Processor Base Power
65 W
Embedded Options Available
No
Max Memory Size (dependent on memory type)
128GB
Memory Types
DDR4-2666
Max # of Memory Channels
2
Max Memory Bandwidth
41.6 GB/s
Direct Media Interface (DMI) Revision
8 GT/s
Max # of DMI Lanes
3
Scalability
1S Only
PCI Express Revision
3.0
PCI Express Configurations
Up to 1×16, 2×8, 1×8+2×4
Max # of PCI Express Lanes
16
Sockets Supported
FCLGA1151
Max CPU Configuration
1
Thermal Solution Specification
PCG 2015C (65W)
T-junction
100°C
Package Size
37.5mm x 37.5mm
Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel® Turbo Boost Max Technology 3.0
No
Intel® Turbo Boost Technology
2.0
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R 150
JHKJDNPJ M.2 NVMe PCIe to PCIe x1 Adapter Card – PCIe 3.0/4.0 SSD Converter, M.2 Key M-Key (2230/2240/2260/2280) NVMe/SATA-like M.2 Drives Compatible with Desktop/Laptop, Plug & Play Installation
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R 50Net Weight 16 Grams Syringe With Bag Packaging Blue 4.0W/M-K GD760 Thermal Conductive Grease Paste Plaster Heat Sink Compound For CPU GPU LED BA7
Product :GD760 Thermal Paste
Color: blue
Specific Gravity:3.0
Thermal Conductivity:4.0W/M-K
Operating Temperature:-58~392 Degree Fahrenheit
GD760 thermal grease thermal conductivity is 4.0 W/M-K.
The higher of your test standard the better and amazing thermally conductive effect it displays. It is easy to smear, and the density is moderate.
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R 150Intel Pentium Dual-Core G2020 Desktop CPU Processor LGA1155 2.9GHz 3MB 5GT/s
Series
Celeron:Dual Core
Clock Speed : 2.90
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R 200
Product name
Samsung DDR3Â SDRAM PC3-10600 2GB Memory
Manufacturer
Samsung Electronics
Data Capacity
2GB
Clock speed
1333Mhz (PC3-10600)
Features
240pin, Unbuffer Non-ECC DDR3 SDRAM DIMM
Production process technology
40nm
Data bits
x64
Internal Module banks
8
Data chip composition
[SEC HCH9 K4B2G0846C] ✕ 8 chips
Depth / Bit organization
256M / x8
Component revision
4th generation
Height
30mm
VDD voltage
1.5V
Operating Case Temperature Range
0°C ~ 85°C
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